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HLMP-CW46, HLMP-CW47. HLMP-CW76, HLMP-CW77
T-1 3/4 (5mm) Extra Bright Precision Optical Performance White LED Lamps.
Data Sheet
Description These high intensity white LED lamps are based on InGaN material technology. A blue LED die is coated by phosphor to produce white. The typical resulting color is described by the coordinates x = 0.31, y = 0.31 using the 1931 CIE Chromaticity Diagram. These T-1 3/4 lamps are untinted, diffused, and incorporate precise optics which produce well-defined spatial radiation patterns at specific viewing cone angle.
Features * * * * * * * * * Well defined spatial radiation pattern High luminous white emission Viewing angle: 50 and 70. Standoff or non-standoff leads Superior resistance to moisture
Applications Electronic signs and signals Small area illumination Legend backlighting General purpose indicators
Benefit * Reduced power consumption, higher reliability, and increased optical/mechanical design flexibility compared to incandescent bulbs and other alternative white light sources.
Caution: Devices are Class 1 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions Package Dimension A Package Dimension B
5.00 0.20 (0.197 0.008) 8.71 0.20 (0.343 0.008) DIMENSION H
5.00 0.20 (0.197 0.008) 8.71 0.20 (0.343 0.008) 1.14 0.20 (0.045 0.008)
2.35 (0.093) MAX. 0.70 (0.028) MAX. 31.60 MIN. (1.244)
1.14 0.20 (0.045 0.008) 1.50 0.15 (0.059 0.006) 0.70 (0.028) MAX.
31.60 MIN. (1.244)
DIMENSION H: 50: 11.98 0.25mm (0.4715 0.01 inches) 70: 11.09 0.25mm (0.4365 0.01 inches)
CATHODE LEAD
CATHODE LEAD
1.00 MIN. (0.039)
0.50 0.10 SQ. TYP. (0.020 0.004)
1.00 MIN. (0.039)
0.50 0.10 SQ. TYP. (0.020 0.004)
5.80 0.20 (0.228 0.008) CATHODE FLAT 2.54 0.38 (0.100 0.015)
5.80 0.20 (0.228 0.008) CATHODE FLAT 2.54 0.38 (0.100 0.015)
Notes: 1. All dimensions are in millimeters /inches. 2. Epoxy meniscus may extend about 1mm (0.040") down the leads. 3. If heat-sinking application is required, the terminal for heat sink is anode.
Part Numbering System
H L M P - CW XX - X X X XX Mechanical Option 00: Bulk DD: Ammo Pack Straight Leads Color Bin Options 0: Full color bin distribution B: Color bin 2 & 3 only Maximum Intensity Bin 0: No maximum intensity bin limit Others: Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Viewing Angle and Standoff Option 46: 50 without standoff 47: 50 with standoff 76: 70 without standoff 77: 70 with standoff
2
Device Selection Guide
Part Number HLMP-CW46-PS0xx HLMP-CW46-QR0xx HLMP-CW46-QRBxx HLMP-CW46-RU0xx HLMP-CW46-ST0xx HLMP-CW46-STBxx HLMP-CW47-PS0xx HLMP-CW47-QR0xx HLMP-CW47-QRBxx HLMP-CW47-RU0xx HLMP-CW47-ST0xx HLMP-CW47-STBxx HLMP-CW76-NR0xx HLMP-CW76-PQ0xx HLMP-CW76-PQBxx HLMP-CW76-QT0xx HLMP-CW76-RS0xx HLMP-CW76-RSBXX HLMP-CW77-NR0xx HLMP-CW77-PQ0xx HLMP-CW77-PQBxx HLMP-CW77-QT0xx HLMP-CW77-RS0xx HLMP-CW77-RSBxx
Typical Viewing Angle, 2 1/2 (Degree) 50 50 50 50 50 50 50 50 50 50 50 50 70 70 70 70 70 70 70 70 70 70 70 70
Intensity (mcd) at 20 MA Min. 880 1150 1150 1500 1900 1900 880 1150 1150 1500 1900 1900 680 880 880 1150 1500 1500 680 880 880 1150 1500 1500 Max. 2500 1900 1900 4200 3200 3200 2500 1900 1900 4200 3200 3200 1900 1500 1500 3200 2500 2500 1900 1500 1500 3200 2500 2500 Standoff No No No No No No Yes Yes Yes Yes Yes Yes No No No No No No Yes Yes Yes Yes Yes Yes
Package Dimension A A A A A A B B B B B B A A A A A A B B B B B B
Notes: 1. Tolerance for luminous intensity measurement is +/- 15% 2. The luminous intensity is measured on the mechanical axis of the lamp package. 3. The optical axis is closely aligned with the package mechanical axis. 4. 21/2 is the off-axis angle where the luminous intensity is 1/2 the on axis intensity 5. Part numbers in BOLD are recommended for new designs.
3
Absolute Maximum Rating at TA = 25oC
Parameters DC forward current Power dissipation LED junction temperature Operating temperature range Storage temperature range
Notes: 1. Derate linearly as shown in figure 2. 2. Duty factor 10%, frequency 1KHz
[1] [2]
Value 30 100 105 110 -40 to +85 -40 to +100
Unit mA mA mW
o o o
Peak pulsed forward current
C C C
Electrical/Optical Characteristics TA = 25oC
Parameters Forward voltage Reverse Voltage
[1]
Symbol VF VR RJ-PIN
[2]
Min 5.0
Typ 3.2 240 0.31 0.31 70
Max 4.0
Units V V
o
Test Condition IF = 20 mA IR = 10 A LED Junction to anode lead IF = 20 mA VF=0, f=1MHz
Thermal resistance Chromaticity Coordinates Capacitance
C/W
X Y C
Notes: 1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 A 2. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device.
1.0
35 IF - FORWARD CURRENT - mA 30
RJ-A = 585C/W
1.5
RELATIVE LUMINOUS INTENSITY
RELATIVE LUMINOUS INTENSITY
0.8 0.6 0.4 0.2 0.0 380
1.2 0.9 0.6 0.3 0 0 10 20 30 FORWARD CURRENT - mA
25
RJ-A = 780C/W
20 15 10 5 0 0 20 40 60 80 100 AMBIENT TEMPERATURE - C
480 580 680 WAVELENGTH - nm
780
Figure 1. Relative Intensity vs. Wavelength
Figure 2. Forward Current vs. Ambient Temperature
Figure 3. Relative Intensity versus DC Forward Current
4
0.025 0.020
IF - FORWARD CURRENT - mA
30
1mA 5mA 10mA
Intensity Bin Limit Table
Intensity (mcd) at 20 mA Bin N P Q R Min 680 880 1150 1500 1900 2500 Max 880 1150 1500 1900 2500 3200
25 20 15 10 5 0
Y-COORDINATES
0.015 0.010 0.005 0.000 -0.005 -0.010 -0.005 30mA
20mA
0.000 0.005 0.010 X-COORDINATES
0.015
2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 VF - FORWARD VOLTAGE - VOLTS Figure 5. Forward Current vs. Forward Voltage
S T
Figure 4. Chromaticity shift vs. Current *Note: (x,y) values @ 20mA reference to (0,0)
U 3200 4200 Tolerance for each bin limit is 15%
1
RELATIVE LUMINOUS INTENSITY
0.5
0 -90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT ()
Figure 6. Spatial Radiation Pattern for CW4x
1
RELATIVE LUMINOUS INTENSITY
0.5
0 -90 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT ()
Figure 7. Spatial Radiation Pattern for CW7x
5
Color Bin Limit Table
Rank 1
Limits (Chromaticity Coordinates) X Y 0.330 0.360 0.287 0.295 0.264 0.267 0.283 0.305 0.330 0.318 0.296 0.276 0.280 0.248 0.287 0.295 0.356 0.351 0.330 0.318 0.296 0.276 0.330 0.339 0.361 0.385 0.330 0.339 0.283 0.305 0.330 0.360
Color Bin Limits with Respect to CIE 1931 Chromaticity Diagram
0.40
0.35
2
X Y
Y-COORDINATE
4 2
1 BLACK BODY CURVE
0.30 3 0.25
3
X Y
4
X Y
0.20 0.26
Tolerance for each bin limit is 0.01
Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago Technologies representative for information on currently available bins.
0.30 0.34 X-COORDINATE
0.38
6
Precautions: Lead Forming: * The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. * If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. * It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Condition: * Care must be taken during PCB assembly and soldering process to prevent damage to LED component. * The closest LED is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoff. * Recommended soldering condition: * Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. * If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. * Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25C before handling. * Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. * Recommended PC board plated through holes size for LED component leads.
Manual Solder Wave Soldering Dipping Pre-heat temperature 105 C Max. Preheat time Peak temperature Dwell time 30 sec Max 250 C Max. 3 sec Max. - - 260 C Max. 5 sec Max
LED component ead size 0.457 x 0.457mm (0.018 x 0.018inch) 0.508 x 0.508mm (0.020 x 0.020inch)
Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch)
Plated through hole diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150mm (0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on soldering LED components.
Recommended Wave Soldering Profile
TURBULENT WAVE 250 LAMINAR WAVE HOT AIR KNIFE
200 BOTTOM SIDE OF PC BOARD
TEMPERATURE - C
150 FLUXING 100
TOP SIDE OF PC BOARD
50 30 PREHEAT
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150 C (100 C PCB) SOLDER WAVE TEMPERATURE = 245 C AIR KNIFE AIR TEMPERATURE = 390 C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. 40 50 TIME - SECONDS 60 70 80 90 100
0
10
20
30
7
For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Pte. All rights reserved. 5989-1431EN - May 29, 2006

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